Qualcomm Is Copying Samsung Exynos 2600’s Heat Path Block For Snapdragon 8 Elite Gen 6 Pro, But Has Botched The Implementation

Imitation remains the highest form of flattery. After Samsung won plaudits for the Exynos 2600’s novel Heat Path Block (HPB) thermal technology, Qualcomm, whose recent chips iterations have resembled a veritable inferno when it comes to their runaway heat issues, now appears to be flattering Samsung by copying its HPB tech for the upcoming Snapdragon 8 Elite Gen 6 Pro, albeit sloppily so.

Qualcomm appears to be trying to tame the furnace-like credentials of its Snapdragon chips by emulating Samsung’s most innovative thermal solution

While clarifying that Qualcomm has prepared two and not six versions of its Snapdragon 8 Elite Gen 6 Pro chip for the upcoming Samsung Galaxy S27 series, the tipster Reptalica has just dropped a bombshell of sorts: Qualcomm’s flagship chip has implemented a version of Exynos 2600’s HPB tech, though the implementation “isn’t as effective.”

For the benefit of those who might not be aware, Exynos 2600 features a copper-based heat sink, dubbed Heat Path Block, which remains in direct contact with the AP.

Of course, the upcoming Exynos 2700 is expected to sport a new thermal solution, called Side-by-Side (SbS), where individual dies for the AP and the DRAM are stacked horizontally, and a copper-based heat sink, called Heat Path Block or HPB, is placed on top.

Meanwhile, based on a previous estimate, the non-binned version of the Snapdragon 8 Elite Gen 6 Pro can cost upwards of $300. This means that only the most premium of smartphones, such as the Galaxy S27 Ultra, will be able to sport the standard Snapdragon 8 Elite Gen 6 Pro, while others will either opt for the vanilla Snapdragon 8 Elite Gen 6 or a binned version.

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