Imitation remains the highest form of flattery. After Samsung won plaudits for the Exynos 2600’s novel Heat Path Block (HPB) thermal technology, Qualcomm, whose recent chips iterations have resembled a veritable inferno when it comes to their runaway heat issues, now appears to be flattering Samsung by copying its HPB tech for the upcoming Snapdragon 8 Elite Gen 6 Pro, albeit sloppily so.
Qualcomm appears to be trying to tame the furnace-like credentials of its Snapdragon chips by emulating Samsung’s most innovative thermal solution
While clarifying that Qualcomm has prepared two and not six versions of its Snapdragon 8 Elite Gen 6 Pro chip for the upcoming Samsung Galaxy S27 series, the tipster Reptalica has just dropped a bombshell of sorts: Qualcomm’s flagship chip has implemented a version of Exynos 2600’s HPB tech, though the implementation “isn’t as effective.”
For the benefit of those who might not be aware, Exynos 2600 features a copper-based heat sink, dubbed Heat Path Block, which remains in direct contact with the AP.
Of course, the upcoming Exynos 2700 is expected to sport a new thermal solution, called Side-by-Side (SbS), where individual dies for the AP and the DRAM are stacked horizontally, and a copper-based heat sink, called Heat Path Block or HPB, is placed on top.
Meanwhile, based on a previous estimate, the non-binned version of the Snapdragon 8 Elite Gen 6 Pro can cost upwards of $300. This means that only the most premium of smartphones, such as the Galaxy S27 Ultra, will be able to sport the standard Snapdragon 8 Elite Gen 6 Pro, while others will either opt for the vanilla Snapdragon 8 Elite Gen 6 or a binned version.
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